Cover substrate attached to a rim substrate with...

Details Cover substrate attached to a rim substrate with... Cover substrate attached to a rim substrate with...

2007-05-31

2010-06-29

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S724000, C257S774000, C257S775000, C361S790000, C361S792000, C438S107000

Reexamination Certificate

active

07745923

ABSTRACT:
A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.

REFERENCES:
patent: 5122856 (1992-06-01), Komiya
patent: 2005/0167795 (2005-08-01), Higashi
patent: 2005-251898 (2005-09-01), None

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