Contact converting structure of semiconductor chip and process f

Details Contact converting structure of semiconductor chip and process f Contact converting structure of semiconductor chip and process f

1998-04-21

1999-09-21

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257741, H01L 2348

Patent

active

059557800

ABSTRACT:
A contact converting structure of a semiconductor chip comprises a semiconductor chip with a group of electrodes arranged on a surface of one side thereof. A liquid crystal polymer film is bonded to the surface in such a manner as to cover the electrodes group, and a group of external contacts is arranged on the other surface of the semiconductor chip. The external contacts group is connected to the electrodes group through the liquid crystal polymer film. A process for manufacturing a semiconductor chip having such a contact converting structure is also disclosed.

REFERENCES:
patent: 4761677 (1988-08-01), Sasaki
patent: 5414301 (1995-05-01), Thomas
patent: 5670827 (1997-09-01), Sakuma et al.

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