Coplanar linear dual switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257692, 257341, 257723, H01L 2348, H01L 2352

Patent

active

055236200

ABSTRACT:
A readily manufacturable low inductance linear semiconductor switching module having coplanar contacts. Also disclosed is a pretestable terminal subassembly for such a module, and a method of making such a terminal subassembly. The module can contain high power, high frequency semiconductor switching devices, operating at high power but low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The terminal subassembly is readily fabricated and assembled into the module. In addition, it permits use of short internal leads that are readily connected to the terminal subassembly.

REFERENCES:
patent: 4907068 (1990-03-01), Amann et al.
patent: 5172215 (1992-12-01), Kobayashi et al.
patent: 5291065 (1994-03-01), Arai et al.
patent: 5371405 (1994-12-01), Kagawa

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