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Face to face chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Face-to-face bonded I/O circuit die and functional logic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Field programmable gate array assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flash memory card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flat-type semiconductor stack

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flexible interposer for stacking semiconductor chips and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flexible tape carrier with external terminals formed on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flexible tape carrier with external terminals formed on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flip chip and wire bond semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flip-chip package with optimized encapsulant adhesion and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Flip-chip sub-assembly, methods of making same and device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Formation of a hybrid integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Glueless integrated circuit system in a packaging module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High bandwidth 3D memory packaging technique

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High capacity memory with stacked layers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High density 3-D integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High density integrated circuit module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High density memory structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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High density multilayer circuit module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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