Fan out type wafer level package structure and method of the...

Details Fan out type wafer level package structure and method of the... Fan out type wafer level package structure and method of the...

2007-03-27

2007-03-27

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23169, C257SE23173

Reexamination Certificate

active

11301303

ABSTRACT:
To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.

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