Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2004-09-29
2008-12-02
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Reexamination Certificate
active
07459772
ABSTRACT:
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of integrated circuit dice each having different logical function circuits disposed thereon. Each member of the first and second sets of integrated circuit dice include an array of face-to-face bonding pads disposed thereon that mate with the array of face-to-face bonding pads of each member of the other set.
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Co-pending U.S. Appl. No. 11/171,488, filed Jun. 29, 2005, entitled Architecture for Face-to-Face Bonding Between Substrate and Multiple Daughter Chips.
Actel Corporation
Ha Nathan W
Lewis and Roca LLP
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