LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Multiple housings

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked board-on-chip package having mirroring structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked carrier three-dimensional memory module and semiconducto

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked chip package using photosensitive polymer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked chip package with enhanced thermal conductivity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked chip package with redistribution lines

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked chip-packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked DCA memory chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die assembly having semiconductor die projecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die BGA or LGA component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die semiconductor device having circuit tape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked die structure with an underlying copper-topped die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked dual MOSFET package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked electronic component and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Stacked electronic structures including offset substrates