Stacked BGA packages

Details Stacked BGA packages Stacked BGA packages

2006-10-10

2006-10-10

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S784000, C257S780000, C257S723000

Reexamination Certificate

active

07119427

ABSTRACT:
Provided are double stacked and multiple stacked BGA packages in which two or more BGA packages are stacked to increase the packaging density. Each of the individual BGA packages included in the stacked BGA packages includes at least one semiconductor chip and a substrate on which the chip is mounted with the substrate(s) being sized to be approximately the same size or, in some instances, slightly larger than the semiconductor chip(s) mounted thereon. A plurality of external contact terminals are provided on each of the substrates, with the corresponding external contact terminals of the multiple BGA packages being electrically connected using a flexible substrate.

REFERENCES:
patent: 6555917 (2003-04-01), Heo
patent: 6770822 (2004-08-01), Pasternak et al.
patent: 2002/0149097 (2002-10-01), Lee et al.
patent: 2004/0113253 (2004-06-01), Karnezos
patent: 2000-0056804 (2000-09-01), None
patent: 2001-0068513 (2001-07-01), None
patent: 2002-0032065 (2002-05-01), None
patent: 2002-0060311 (2002-07-01), None
patent: 2003-0012192 (2003-02-01), None
Office Action mailed Oct. 21, 2005 for counterpart Korean Patent Application No. 10-2003-0080079 and English translation.

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