Stacked chip assembly

Details Stacked chip assembly Stacked chip assembly

1996-08-29

1999-01-19

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257777, 257723, 257779, 257785, H01L 2302, H01L 2348, H01L 2334

Patent

active

058616667

ABSTRACT:
An assembly of semiconductor chips has the chips vertically stacked above one another. Interposers extending between adjacent chips have compliant layers to accommodate thermal expansion of the chips. Desirably, the interposers have metallic plates to conduct heat from the interior of the stack.

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