Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-08-02
2005-08-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S787000, C257S784000, C257S737000, C257S738000, C257S780000
Reexamination Certificate
active
06924550
ABSTRACT:
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an interposer substrate includes depositing a solder ball onto a ball-pad on the interposer substrate and molding a compound to form a casing around at least a portion of the die and the solder ball. The method can further include forming a first cover over a first surface of the interposer substrate with the compound and forming a second cover over a second surface opposite the first surface of the interposer substrate with the compound. The first cover can have a first volume and a first surface area and the second cover can have a second volume and a second surface area. The first and second volumes and the first and second surface areas can be at least approximately equal.
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Brooks Mike
Corisis David J.
Micro)n Technology, Inc.
Parekh Nitin
Perkins Coie LLP
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