Package structures

Details Package structures Package structures

2007-01-02

2010-12-28

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S687000, C257S776000, C257S777000, C257SE21504, C257SE23169

Reexamination Certificate

active

07859092

ABSTRACT:
A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die.

REFERENCES:
patent: 5640044 (1997-06-01), Takehashi et al.
patent: 2003/0153123 (2003-08-01), Tsai et al.
patent: 2004/0021230 (2004-02-01), Tsai et al.
patent: 2006/0094222 (2006-05-01), Wong et al.
patent: 2007/0057381 (2007-03-01), Wong et al.

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