Two part mold for wafer scale caps

Underside heat slug for ball grid array packages

Use of solder paste for heat dissipation

Vacuum package fabrication of integrated circuit components

Vacuum package fabrication of integrated circuit components

Vacuum sealed package for semiconductor chip

Vented semiconductor device package having separate...

Vertical lead-on-chip package

Wafer level hermetic bond using metal alloy with raised feature

Wafer level package configured to compensate size difference...

Wafer level package structure and production method therefor

Wafer level package structure with a heat slug

Wafer level packaging cap and fabrication method thereof

Wafer packaging and singulation method

Wafer scale fiber optic termination

Wafer-level package structure

Wafer-level package with silicon gasket

Wafer-level seal for non-silicon-based devices

Wafer-pair having deposited layer sealed chambers

Wire bond-less electronic component for use with an external...