Back-face and edge interconnects for lidded package
Ball grid array integrated circuit package with palladium...
Ball grid array package comprising a heat sink
Ball grid array package enhanced with a thermal and...
Ball grid array package having one or more stiffeners
Ball grid array package system
Ball grid array package with patterned stiffener layer
Ball grid array package with patterned stiffener surface and...
Ball grid array semiconductor package
Ball grid array structure and method for packaging an integrated
Ball grid array type package for semiconductor device
Ball grid array type semiconductor device
Ball-grid-array-type semiconductor device
Barrier layers for thin film electronic materials
BGA/LGA with built in heat slug/spreader
Board-on-chip packages
Bondable anodized aluminum heatspreader for semiconductor...
Bonded assembly having improved adhesive bond strength
Bonded assembly having improved adhesive bond strength
Bottom heat spreader