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Back-face and edge interconnects for lidded package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array integrated circuit package with palladium...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package comprising a heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package enhanced with a thermal and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package having one or more stiffeners

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package with patterned stiffener layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array package with patterned stiffener surface and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ball grid array type package for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ball grid array type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ball-grid-array-type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Barrier layers for thin film electronic materials

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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BGA/LGA with built in heat slug/spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Board-on-chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bondable anodized aluminum heatspreader for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bottom heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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