LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low cost power semiconductor module without substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low cost, thermally efficient, and surface mountable semiconduct

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low k dielectric insulator and method of forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low mechanical stress, high electrical and thermal conductance s

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low noise high thermal conductivity mixed signal package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low temperature co-fired ceramic (LTCC) tape compositions,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low temperature co-fired ceramic-metal packaging technology

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low thermal expansion composite comprising bodies of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low warpage flip chip package solution-channel heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low-inductance power semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low-temperature calcined ceramics

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Manufacture of mountable capped chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Manufacturing of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Member for electronic circuit, method for manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

MEMS device with conductive path through substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Metal adhesion layer in an integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Metal-ceramic composite lid