Memory module

Details Memory module Memory module

2008-01-29

2008-01-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S697000, C257S698000, C257SE23181

Reexamination Certificate

active

07323775

ABSTRACT:
A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT, soldering paste, or flux for IC maintenance and replacement; the IC embedding seat comprises a mainbody and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and the mainbody has one or more IC mounting compartments has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, the defective IC memory chip shall be freely removed from the memory module without de-soldering to prevent other good IC memory chip from damage due to high temperature.

REFERENCES:
patent: 6168452 (2001-01-01), Lai et al.
patent: 6186816 (2001-02-01), Lu et al.
patent: 2004/0222514 (2004-11-01), Crane et al.

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