Low cost power semiconductor module without substrate

Details Low cost power semiconductor module without substrate Low cost power semiconductor module without substrate

2006-07-28

2009-06-09

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257SE23079, C257SE23103

Reexamination Certificate

active

07545033

ABSTRACT:
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.

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Cancellation Proceedings for Decision of Appeal on May 2, 2006 for Appeal Case No. 2004-1932—Japanese Application No. 2001-005156.

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