Metal-ceramic composite lid

Details Metal-ceramic composite lid Metal-ceramic composite lid

1994-07-08

1996-07-02

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257704, 257705, 257706, 257729, H01L 23053, H01L 2306

Patent

active

055325130

ABSTRACT:
A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.

REFERENCES:
patent: 3941916 (1976-03-01), Morse
patent: 4141029 (1979-02-01), Dromsky
patent: 4229758 (1980-10-01), Ikari
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4331258 (1982-05-01), Geschwind
patent: 4366342 (1982-12-01), Breedlove
patent: 4546405 (1985-10-01), Hultmark et al.
patent: 4601958 (1986-07-01), Levine
patent: 4640436 (1987-02-01), Miyoshi et al.
patent: 4640438 (1987-02-01), Trevison et al.
patent: 4666796 (1987-05-01), Levine
patent: 4737418 (1988-04-01), Slattery
patent: 4746583 (1988-05-01), Falanga
patent: 4833102 (1989-05-01), Byrne et al.
patent: 4835067 (1989-05-01), Levine
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 4842961 (1989-06-01), Basile et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 5005631 (1991-04-01), Dwivedi
patent: 5045639 (1991-09-01), Liu et al.
patent: 5119864 (1992-06-01), Langensiepen et al.
patent: 5240062 (1993-08-01), Langensiepen et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5386339 (1995-01-01), Polinski, Sr.
Abstract Citation of U.S. Pat. No. 3,659,035.

Affiliated with

Also associated with

Rating

Metal-ceramic composite lid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal-ceramic composite lid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal-ceramic composite lid will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1508623