Low noise high thermal conductivity mixed signal package

Details Low noise high thermal conductivity mixed signal package Low noise high thermal conductivity mixed signal package

2009-07-23

2011-11-29

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S713000, C257SE21511

Reexamination Certificate

active

08067833

ABSTRACT:
An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semiconductor die (105) and housed inside the device package to decouple noise from input signals, and a heat spreader (195) disposed between a top surface of the semiconductor die (105) and a package cover (185). The semiconductor die (105) is configured as a flip chip die and the device package includes a package substrate (110) configured as a ball grid array. The improved microelectronic device (100) reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate (115) and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

REFERENCES:
patent: 5866943 (1999-02-01), Mertol
patent: 7335987 (2008-02-01), Huang

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