Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1994-09-02
1996-04-23
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257718, 257748, 257747, H01L 2304, H01L 2348
Patent
active
055106501
ABSTRACT:
This invention includes semiconductor devices including the heat sink with a slitted metal strip, such as copper, which is coiled or folded to produce an array of flexible flat fingers for mechanical, thermal and electrical contact with the silicon die, such as a power transistor. The use of a slitted metal strip instead of a bundle of wires makes fabrication of the flexible mount simpler and more economical. The flexible flat fingers are able to accommodate hot spots on the semiconductor device and change in thermal gradients as the device is operated. The slitted metal strip reduces mechanical stress on the die and the die attach solder to avoid solder fatigue which is a wear-out,mechanism that can cause failure of the semiconductor device; keep the magnitude of mechanical stresses from becoming large enough to fracture the silicon die; permit the use of higher melting temperature hard solders which are more resistant to solder fatigue; and permit peak operating temperatures of the semiconductor device to be higher than possible with devices that are mounted with soft die attach solder.
REFERENCES:
patent: 2927953 (1960-03-01), Staller
patent: 3128419 (1964-04-01), Waldkotter et al.
patent: 4315591 (1982-02-01), Houston
patent: 4333102 (1982-06-01), Jester et al.
patent: 4407006 (1983-09-01), Holick et al.
patent: 4952999 (1990-08-01), Robinson et al.
Burgess et al., "Solder Fatigue Problems in Power Packages", IEEE Transactions on Components . . . , vol. CHMT-7, No. 4, Dec. 1984, pp. 405-410.
Glascock, II et al., "Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices", IEEE Transactions on Components . . . , vol. CHMT-6, No. 4, Dec. 1984, pp. 460-466.
Brooks Cary W.
General Motors Corporation
Hardy David B.
Limanek Robert P.
LandOfFree
Low mechanical stress, high electrical and thermal conductance s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low mechanical stress, high electrical and thermal conductance s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low mechanical stress, high electrical and thermal conductance s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2310992