Manufacturing of semiconductor device

Details Manufacturing of semiconductor device Manufacturing of semiconductor device

1996-03-11

2000-07-04

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257678, H01L 23053, H01L 2312

Patent

active

060842989

ABSTRACT:
In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface, and pads provided in a peripheral portion of the second opening on the first surface side of the recession section. A semiconductor element mounted on a mount substrate is inserted in the first opening from the second surface side of the ceramic package. The semiconductor element is smaller than the mount substrate and has pads in a peripheral portion of the semiconductor element. The pads on the recession section and the pads on the semiconductor element are connected by electrically conductive wires.

REFERENCES:
patent: 4340902 (1982-07-01), Honda et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5650593 (1997-07-01), McMillan et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5698896 (1997-12-01), Komatsu et al.
patent: 5721454 (1998-02-01), Palmer

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