MEMS device with conductive path through substrate

Details MEMS device with conductive path through substrate MEMS device with conductive path through substrate

2005-08-30

2005-08-30

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S777000, C257S730000, C257S774000, C257S750000, C257S754000

Reexamination Certificate

active

06936918

ABSTRACT:
A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.

REFERENCES:
patent: 5314572 (1994-05-01), Core et al.
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5345824 (1994-09-01), Sherman et al.
patent: 5417111 (1995-05-01), Sherman et al.
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 5540095 (1996-07-01), Sherman et al.
patent: 5610431 (1997-03-01), Martin
patent: 5620931 (1997-04-01), Tsang et al.
patent: 5872496 (1999-02-01), Asada et al.
patent: 6153839 (2000-11-01), Zavracky et al.
patent: 6303986 (2001-10-01), Shook
patent: 6307169 (2001-10-01), Sun et al.
patent: 6335224 (2002-01-01), Peterson et al.
patent: 6384353 (2002-05-01), Huang et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 6433411 (2002-08-01), Degani et al.
patent: 6436853 (2002-08-01), Lin et al.
patent: 6448109 (2002-09-01), Karpman
patent: 6448622 (2002-09-01), Franke et al.
patent: 6452238 (2002-09-01), Orcutt et al.
patent: 6512300 (2003-01-01), Cheever et al.
patent: 6559530 (2003-05-01), Hinzel et al.
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6633079 (2003-10-01), Cheever et al.
patent: 6743656 (2004-06-01), Orcutt et al.
patent: 6753208 (2004-06-01), MacIntyre
patent: 6781239 (2004-08-01), Yegnashankaran et al.
patent: 6852926 (2005-02-01), Ma et al.
patent: 2003/0038327 (2003-02-01), Smith
patent: 2004/0016989 (2004-01-01), Ma et al.
patent: 2004/0077154 (2004-04-01), Nagarajan et al.
Boustedt et al., “Flip Chip as an Enabler for MEMS Packaging”, 2002 Electronic Components and Technology Conference, pp. 124-128.
Ok et al., Generic, Direct-Chip-Attach MEMS Packaging Design with High Density and Aspect Ration through-Wafer Electrical Interconnect, 2002 Electronic Components and Technology Conference, pp. 232-237.
Ziptronix White Paper, “MEMS: Mainstream Process Integration”.
Teomim et al, “An innovative approach to wafer-level MEMS packaging”, pp. 1-4.
ShellBGA www.shellcase.com/pages/products-shellbga.asp.
Seeger et al. Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications, @2003 Society of Photo-Optical Instrumentation Engineers, pp. 169-177, Jul. 2003.
Park et al.,A Novel-Low-Loss Wafer-Level Packaging of the RF-MEMS Devices, 2002 IEEE, Doc. No. 0-7803-7185, Feb. 2002, 681-684, 4 pages.
Ok et al.,High Density, High Aspect Ratio Through-Wafer Electrical Interconnect Vias for MEMS Packaging, 2003 IEEE Transactions on Advanced Packaging, vol. 26, No. 3, Doc. No. 1521-3323, Aug. 2003, 302-309, 8 pages.
Premachandran et al.,A Novel Electrically Conductive Wafer Through Hole Fille Vias Interconnect for 3D MEMS Packaging, 627-630, 2003, 4 pages.
Ando et al.,New Packaging Technology for SAW Device, Corporate Components Development Center, Doc. No. WA1-3, 403-406, 4 pages.

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