Package structure with increased capacitance and method
Package substrate including surface mount component mounted...
Packaged combination memory for electronic devices
Packaged electronic module and integral sensor array
Packaging and interconnect system for integrated circuits
Packaging multi-chip modules without wire-bond interconnection
Packaging of hybrid integrated circuits
Packaging of solid state devices
Packaging silicon on silicon multichip modules
Packaging structure
Packaging structure with coplanar filling paste and dice and...
Packaging structure with coplanar filling paste and dice and...
Parallel dual switch module
Passive electronic parts, IC parts, and wafer
Passive element chip and manufacturing method thereof, and...
Perpendicularly oriented electrically active element method...
Plasticized polyetherimide adhesive composition and usage
Power hybrid integrated circuit apparatus
Power module
Power module