Packaged electronic module and integral sensor array

Details Packaged electronic module and integral sensor array Packaged electronic module and integral sensor array

1998-02-26

1999-02-09

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257680, 257684, 257723, H01L 2334, H01L 2302

Patent

active

058698965

ABSTRACT:
An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

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