Power hybrid integrated circuit apparatus

Details Power hybrid integrated circuit apparatus Power hybrid integrated circuit apparatus

1995-03-16

1997-08-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257668, 257691, 257725, 257728, H01L 2334

Patent

active

056613431

ABSTRACT:
An input-output wiring for the power circuit and a ground layer are formed on a metal substrate of a power hybrid integrated circuit apparatus. A plurality of windows are opened at predetermined positions of a circuit substrate to which electronic parts such as an IC driver, a chip resistor etc. are connected. Ceramic chips are soldered on the exposed surface of the metal substrate in the windows, and the power semiconductor elements are connected through metal bridges on the ceramic chips. Connection between lower electrode of adjoining power semiconductor elements or between lower part of the power semiconductor element and an input/output wiring is made by means of a part of the metal bridge.

REFERENCES:
patent: 5198963 (1993-03-01), Gupta et al.
patent: 5206712 (1993-04-01), Kornrumpf et al.
patent: 5291065 (1994-03-01), Arai et al.
patent: 5424579 (1995-06-01), Arai et al.

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