Plasticized polyetherimide adhesive composition and usage

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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257668, 257702, 361761, H01L 2316

Patent

active

053008120

ABSTRACT:
A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.

REFERENCES:
patent: 4783695 (1988-11-01), Eckelberger et al.
patent: 5047487 (1991-09-01), Camargo et al.
patent: 5236988 (1993-08-01), Doyama et al.

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