Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-05-08
2007-05-08
Tran, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE25029, C361S717000, C361S738000
Reexamination Certificate
active
10503254
ABSTRACT:
A power module includes at least one carrier body for mounting at least one power component thereon, and at least one energy storage component. For this purpose, a hybrid circuit is arranged as a thick film circuit on at least one of the carrier bodies, and the hybrid circuit includes at least one thick film resistor as a discharging resistor for discharging the at least one energy storage component. The power module is adapted for use as a power converter for electric motors.
REFERENCES:
patent: 3766440 (1973-10-01), Baird
patent: 3908184 (1975-09-01), Anazawa et al.
patent: 5134094 (1992-07-01), Schovanec
patent: 5245510 (1993-09-01), Honda
patent: 5294831 (1994-03-01), Azar et al.
patent: 5491370 (1996-02-01), Schneider et al.
patent: 5585681 (1996-12-01), Bitsche
patent: 5966291 (1999-10-01), Baeumel et al.
patent: 6111494 (2000-08-01), Fischer et al.
patent: 6140571 (2000-10-01), Kitahara et al.
patent: 6166464 (2000-12-01), Grant
patent: 6194856 (2001-02-01), Kobayashi et al.
patent: 6198183 (2001-03-01), Baeumel et al.
patent: 6580590 (2003-06-01), Holmquist et al.
patent: 6661659 (2003-12-01), Tamba et al.
patent: 2002/0008967 (2002-01-01), Feustel et al.
patent: 2004/0057208 (2004-03-01), Baeumel et al.
patent: 19735074 (1998-09-01), None
patent: 2 261 549 (1993-05-01), None
patent: 57-69768 (1982-04-01), None
patent: 2-276264 (1990-11-01), None
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, Inc., Chapter 7: pp. 7.1,7.2,7.3,7.16,7.17,7.18,7.26.
IBM Technical Disclosure Bulletin, XP-002237832, “Ceramic Substrate With Inherent Heat Exchanger”, H. R. Pilgrim, vol. 12, No. 5, Oct. 1969.
Baeumel Hermann
Briggs William T.
George Dietrich
Graf Werner
Kilian Hermann
Conti Temic microelectronic GmbH
Fasse W. F.
Fasse W. G.
Rodela Eduardo A.
Tran Minhloan
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