Package substrate including surface mount component mounted...

Details Package substrate including surface mount component mounted... Package substrate including surface mount component mounted...

2011-01-25

2011-01-25

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S737000, C257SE23010

Reexamination Certificate

active

07875973

ABSTRACT:
A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.

REFERENCES:
patent: 6721187 (2004-04-01), Hall et al.
patent: 6727116 (2004-04-01), Poo et al.

Affiliated with

Also associated with

Rating

Package substrate including surface mount component mounted... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package substrate including surface mount component mounted..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package substrate including surface mount component mounted... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2705564