Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-07-15
2008-07-15
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE25029, C438S107000
Reexamination Certificate
active
11026488
ABSTRACT:
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
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Chao Kuang-Chi
Chiu Cheng-hsien
Sun Wen-Bin
Yang Chin-Chen
Yang Wen-Kun
Advanced Chip Engineering Tachnology Inc.
Kusner & Jaffe
Weiss Howard
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