Heat transfer material for an improved die edge contacting...
Hermetic chip and method of manufacture
Hermetically sealed high density multi-chip package
High density memory array packaging
High density memory card assembly
High density memory card assembly
High density packaging of solid state devices
High frequency semiconductor device
High performance capacitor
High performance multi-chip flip chip package
High performance multi-chip flip chip package
High performance multi-chip flip package
High performance packaging for microprocessors and DRAM...
High performance, low cost microelectronic circuit package...
High power MCM package with improved planarity and heat...
High power semiconductor switch module
High speed electronic interconnection using a detachable...
High temperature operating package and circuit design
High-density electronic module
High-density wirebond chip interconnect for multi-chip modules