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Integrated circuit package system with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Integrated circuit package system with heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
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Integrated circuit package system with molding vents

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Integrated circuit package with a heat dissipation device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Integrated circuit package-in-package system with leads

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Integrated circuit packaging system having planar interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Integrated circuit packaging system with multi level contact...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Integrated circuit packaging system with package-on-package...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Integrated circuit underfill package system

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Integrated circuits, and methods of fabricating same, which take

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Integrated heatspreader for use in wire bonded ball grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Ion beam irradiation apparatus and ion beam irradiation method

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Irregular grid bond pad layout arrangement for a flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Latent catalysts for molding compounds

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Layer between interfaces of different components in...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Lead-free glass tubing, especially for encapsulating diodes...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Lead-on-chip type of semiconductor package with embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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LED lamp having particular lead arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Light emitting diode with sealant having filling particles

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate

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