Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2009-09-15
2011-10-11
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S780000, C257S737000, C257SE23116, C257SE23123, C438S127000, C438S613000
Reexamination Certificate
active
08035235
ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exposed interconnect to the base substrate, a portion of the exposed interconnect having the buffer layer attached thereon, mounting a base component over the base substrate, forming a base encapsulation over the base substrate and the exposed interconnect using the encapsulation system; and releasing the encapsulation system providing the portion of the exposed interconnect exposed from the base encapsulation, the exposed interconnect having characteristics of the buffer layer removed.
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Chi HeeJo
Cho NamJu
Jang Ki Youn
Ishimaru Mikio
Parekh Nitin
Stats Chippac Ltd.
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