Integrated circuit package-in-package system with leads

Details Integrated circuit package-in-package system with leads Integrated circuit package-in-package system with leads

2011-01-11

2011-01-11

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S723000, C257S678000, C257SE23126

Reexamination Certificate

active

07868471

ABSTRACT:
An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.

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