Layer between interfaces of different components in...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Details

C257S666000, C257SE23077, C977S742000, C977S785000, C977S831000

Reexamination Certificate

active

07834467

ABSTRACT:
A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

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D. Qian et al.; “Load Transfer and Deformation Mechanisms in Carbon Nanotube-Polystyrene Composites”, Applied Physics Letters, vol. 76, No. 20, May 15, 2000, pp. 2868-2870.

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