Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2007-03-28
2010-11-16
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S666000, C257SE23077, C977S742000, C977S785000, C977S831000
Reexamination Certificate
active
07834467
ABSTRACT:
A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.
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D. Qian et al.; “Load Transfer and Deformation Mechanisms in Carbon Nanotube-Polystyrene Composites”, Applied Physics Letters, vol. 76, No. 20, May 15, 2000, pp. 2868-2870.
Bauer Michael
Haimerl Alfred
Hosseini Khalil
Kessler Angela
Mahler Joachim
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Parekh Nitin
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