Integrated circuit package system with heat sink

Details Integrated circuit package system with heat sink Integrated circuit package system with heat sink

2008-07-15

2008-07-15

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S707000, C257S787000

Reexamination Certificate

active

11307683

ABSTRACT:
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.

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