Integrated circuit packaging system having planar interconnect

Details Integrated circuit packaging system having planar interconnect Integrated circuit packaging system having planar interconnect

2011-03-22

2011-03-22

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S784000, C257S786000

Reexamination Certificate

active

07911070

ABSTRACT:
An integrated circuit package system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.

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