Integrated heatspreader for use in wire bonded ball grid...

Details Integrated heatspreader for use in wire bonded ball grid... Integrated heatspreader for use in wire bonded ball grid...

2007-06-26

2007-06-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S706000, C257S707000, C257S712000, C257S713000, C257S722000, C257SE23103, C257SE23105

Reexamination Certificate

active

10939082

ABSTRACT:
The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat spreader mounted on the substrate. An IC die is mounted to the heat spreader such that the heat spreader lies in between the die and the substrate. The invention is also directed to a heat spreader plate useable in a semiconductor package. The heat spreader plate comprises a plate comprised of thermally conductive material suitable for attachment to a packaging substrate wherein the plate includes openings for exposing electrical bonding surfaces of a packaging substrate when the heater spreader plate is mounted on the packaging substrate. Such openings enable wirebonding between the exposed electrical bonding surfaces of the substrate and an integrated circuit die to complete construction of a package including the heatspreader.

REFERENCES:
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6751099 (2004-06-01), Vrtis et al.
patent: 7005737 (2006-02-01), Zhao et al.

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