Integrated circuit package system with heat slug

Details Integrated circuit package system with heat slug Integrated circuit package system with heat slug

2009-03-04

2011-10-11

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S717000, C257SE23110

Reexamination Certificate

active

08035237

ABSTRACT:
An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.

REFERENCES:
patent: 6331451 (2001-12-01), Fusaro et al.
patent: 6441499 (2002-08-01), Nagarajan et al.
patent: 6918178 (2005-07-01), Chao et al.
patent: 6933176 (2005-08-01), Kirloskar et al.
patent: 2003/0104656 (2003-06-01), Ahmad
patent: 2003/0106212 (2003-06-01), Chao et al.
patent: 2004/0195697 (2004-10-01), Boon et al.

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