Integrated circuit package with a heat dissipation device

Details Integrated circuit package with a heat dissipation device Integrated circuit package with a heat dissipation device

2011-04-19

2011-04-19

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S686000, C257S777000, C257S795000

Reexamination Certificate

active

07928590

ABSTRACT:
Integrated circuit assembly including a die stack assembly having a heat dissipation device thermally coupled to a lateral of surface the die stack assembly. The die stack assembly includes a plurality integrated circuits placed on each other. In another embodiment a heat dissipation device comprising an encapsulant is thermally coupled to and surrounds a die stack assembly that includes a plurality of integrated circuits placed on each other. At least one heat conducting intermediate layer between integrated circuits is thermally coupled to the heat dissipation device.

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