Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1989-12-22
1994-05-17
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257666, 257692, 257696, 257792, 257778, H01L 2328, H01L 2348, H01L 2944, H01L 2952
Patent
active
053131029
ABSTRACT:
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.
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I. Fukuzawa, et al., "Moisture Resistance Degradation of Plastic LSIs By Reflow Soldering", 1985 IEEE/IRPS, pp. 192-197.
Lim Thiam B.
Saitoh Tadashi
Seow Boon Q.
Brady Wade J.
Donaldson Richard L.
James Andrew J.
Jr. Carl Whitehead
Texas Instruments Incorporated
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