Integral heat spreader for semiconductor package

Details Integral heat spreader for semiconductor package Integral heat spreader for semiconductor package

1998-07-23

1999-10-26

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257675, 257706, 257707, 257720, H01L 2328

Patent

active

059734078

ABSTRACT:
The present invention disclose an Integral heat spreader for semiconductor package which is a metal plate and characterized in that a plurality of upper bumps are provided on the top surface of the metal plate. By the provision of the upper bumps, one or more space(s) can be formed between the bottom surface of the paddle and the top surface of the heat spreader for the compact filling of molding compound. Therefore, the occurrence of gap or delamination can be prevented, while maintaining the necessary effect of heat dissipation.

REFERENCES:
patent: 5367196 (1994-11-01), Mahulika et al.
patent: 5859471 (1999-01-01), Kuraishi et al.

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