Integrated circuit package system with delamination...

Details Integrated circuit package system with delamination... Integrated circuit package system with delamination...

2011-08-30

2011-08-30

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S784000, C257S790000, C257SE23126, C438S127000, C438S617000

Reexamination Certificate

active

08008787

ABSTRACT:
An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.

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