Integrated circuit package system with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Details

C257S707000, C257S787000

Reexamination Certificate

active

07400049

ABSTRACT:
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.

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