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Semiconductor package with lead frame as chip carrier and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Semiconductor package with pattern leads and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Semiconductor package with pocket for sealing material

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Semiconductor pressure sensor device protected with...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Semiconductor rectifying device and full-wave rectifier fabricat

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Semiconductor wafer, and semiconductor device formed therefrom

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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SMT passive device noflow underfill methodology and structure

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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SMT passive device noflow underfill methodology and structure

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Solid state device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Solid state pickup device excellent in heat-resistance and metho

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Stacked type chip package structure including a chip package...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Stacking and encapsulation of multiple interconnected...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Stress relief matrix for integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Structure, material, and design for assembling a low-K Si...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Structure, material, and design for assembling a low-K Si...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Substrate for semiconductor device and semiconductor device usin

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Substrate for semiconductor device, semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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System and method for hermetically sealing a package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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