SMT passive device noflow underfill methodology and structure

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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C257S783000, C257SE23123

Reexamination Certificate

active

07408264

ABSTRACT:
An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.

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AMICON® E 1350 Series, “No Flow-Fluxing Underfill Encapsulants for Flip Clip Devices”, Emerson & Cuming, Specialty Polymers.
SE-CURE® 9101 “Reflow Encapsulant”, Kester Solder, Polymer Products Group.
Staychip™, NUF-DP0071—No Flow Underfill, Developmental Product Information.
Dexter, HYSOL® FF 2200, “Reflow Encapsulant”.
Dexter, HYSOL® FluxFill™ 2000, “Reflow Encapsulant”.

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