Solid state pickup device excellent in heat-resistance and metho

Details Solid state pickup device excellent in heat-resistance and metho Solid state pickup device excellent in heat-resistance and metho

1999-03-25

2000-11-07

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257790, 257791, 257787, 257783, 257 99, 257100, 257433, H01L 2329, H01L 2328, H01L 310203

Patent

active

061441074

ABSTRACT:
A solid state pickup device to which the present invention is applicable comprises a base member (1a) and a solid state pickup chip (3) having a bottom surface, a receiving surface for receiving light signal, and a side surface. The solid state pickup chip is glued on the base member by using a first adhesive (7). The solid state pickup device further comprises a solid package (6) formed around the base member and the solid state pickup chip having transparency. Herein, the first adhesive has flexibility. The solid state pickup device still further comprises a covering member (5) formed around the receiving and the side surfaces of the solid state pickup chip having transparency and flexibility.

REFERENCES:
patent: 4710797 (1987-12-01), Tanaka
patent: 5557066 (1996-09-01), Rostoker et al.
patent: 5566051 (1996-10-01), Burns
patent: 5644169 (1997-07-01), Chun

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