Stacking and encapsulation of multiple interconnected...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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C257S686000, C257S685000, C257S723000, C257S087000, C257S777000, C257S724000, C257S725000, C257S728000, C257S680000, C257S679000, C257S787000, C257S788000, C382S103000, C382S154000, C382S161000, C713S169000, C713S193000, C713S168000

Reexamination Certificate

active

06998721

ABSTRACT:
In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation structure which at least partially encases the first encapsulation structure, the first integrated circuit, and the electronic component.

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