Substrate for semiconductor device and semiconductor device usin

Details Substrate for semiconductor device and semiconductor device usin Substrate for semiconductor device and semiconductor device usin

1996-05-10

1998-07-14

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257793, 257678, 257787, 257698, H01L 2329, H01L 2302, H01L 2328, H01L 2304

Patent

active

057809330

ABSTRACT:
A one-sided sealed type semiconductor device comprising a substrate proper for a one-sided resin mold provided on the first main surface thereof with a wiring circuit including connection parts for semiconductor elements and on the second main surface thereof with flat type external connection terminals led out thereon via a through hole, semiconductor elements set in place and packaged in predetermined areas of the first main surface of the substrate proper, a transfer mold resin layer for sealing solely the surface having the semiconductor elements packaged thereon, and a metallic layer formed on the first main surface independently of wiring circuit and outside the area having the wiring circuit.

REFERENCES:
patent: 4907061 (1990-03-01), Kohara

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