Semiconductor pressure sensor device protected with...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Details

C257S795000, C257S787000, C257S684000, C257S687000, C257S729000

Reexamination Certificate

active

06844632

ABSTRACT:
In a semiconductor pressure sensor device comprising a housing (1) having a cavity (3), a semiconductor sensor chip (2) mounted within the cavity, leads (4) for conveying pressure detection signals, and bonding wires (6) electrically connecting the sensor chip and the leads, a sensitive portion (2a) of sensor chip (2), leads (4) and bonding wires (6) are covered with an electrically insulating fluorochemical gel material which has a penetration of 30-60 according to JIS K2220, a Tg of up to −45° C., and a degree of saturation swelling in gasoline at 23° C. of up to 7% by weight. The sensor device is improved in operation reliability and durability life.

REFERENCES:
patent: 6111221 (2000-08-01), Miyakoshi et al.
patent: 6472581 (2002-10-01), Muramatsu et al.
patent: 2525433 (1996-05-01), None
patent: 2001-99737 (2001-04-01), None
patent: 2001-153746 (2001-06-01), None
patent: 2001-304999 (2001-10-01), None
patent: 2001-311673 (2001-11-01), None

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