System and method for hermetically sealing a package

Details System and method for hermetically sealing a package System and method for hermetically sealing a package

2007-08-21

2009-06-23

Brewster, William M. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C438S124000, C438S126000

Reexamination Certificate

active

07550859

ABSTRACT:
A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 6541314 (2003-04-01), Kobayashi
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6588949 (2003-07-01), Zhou
patent: 2001/0025721 (2001-10-01), Maeda et al.

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