Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1997-11-05
1999-04-13
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257737, 257738, 257778, 257780, H01L 2329, H01L 2348, H01L 2352, H01L 2940
Patent
active
058941738
ABSTRACT:
An integrated circuit package (10, 40) may comprise an integrated circuit chip (12, 42) and a substrate (14, 44) opposite the chip (12, 42). A connector (20, 52) may be disposed between the chip (12, 42) and the substrate (14, 44) to electrically couple the chip (12, 42) and the substrate (14, 44). A matrix (24, 50) may be disposed about the connector (20, 52). The matrix (24, 50) may comprise a blend of liquid crystal polymer and thermoplastic polymer. The matrix (24, 50) may have a coefficient of thermal expansion in a direction (26, 56) substantially parallel to the chip (12, 42) and the substrate (14, 44) that is greater than that of the chip (12, 42) and that is less than that of the substrate (14, 44) in the substantially parallel direction (26, 56). In a direction (28, 58) normal to the substantially parallel direction (26, 56), the matrix (24, 50) may have a coefficient of thermal expansion that is approximately that of the connector (20, 52).
REFERENCES:
patent: 4825284 (1989-04-01), Soga et al.
patent: 4886686 (1989-12-01), Muenstedt
patent: 5553769 (1996-09-01), Ellerson et al.
patent: 5659203 (1997-08-01), Call et al.
patent: 5709960 (1998-01-01), Mays et al.
"Aluminum Nitride Cap Design Obviating Problems of Thermal Conductivity and TEC Associated with Ploymer Ceramic Substrate," IBM Technical Disclosure Bulletin, Dec. 1991, vol. 34, No. 7B pp. 341-342.
"Flip Chart Attachment Using Non-Conductive Adhesives and Gold Ball Bumps," by R. Aschenbrenner, J. Gwiasda, J. Eldring, E. Zakel and H. Reichl, 1994 IEPS Conference.
"Direct Chip Interconnect with Adhesive-Connector Films," by Nagesh R. Basavanhally, David D. Chang and Benjamin H. Cranston, 1992 IEEE.
"Reworkable Encapsulation for Flip-Chip Packaging," by Frank L. Pompeo, Anson J. Call and Jeffrey T. Coffin, Interpak 95 Proceedings, Hawaii, Mar. 1995.
Heinen Katherine G.
Jacobs Elizabeth G.
Arroyo Teresa M.
Brady III W. James
Donaldson Richard L.
Garner Jacqueline J.
Texas Instruments Incorporated
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